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FBGA256 17x17mm   LQFP144 20x20mm   EQFP176 20x20mm



AG10K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG10K offers supreme quality, stability, and exceptional pricing value.



  • High-density architecture with 10K LEs
  • M9K embedded memory blocks, up to 414Kbits of RAM space
  • Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
  • Provides 2 PLLs per device provide clock multiplication and phase shifting
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
  • Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
  • General package options, LQFP-144, -176 and FBGA-256
  • Flexible device configuration through JTAG and SPI interface
  • Support remote update, by "dual-boot" like implementation
  • Refer "User Guide" for special AS mode configuration

Download Datasheet

EVB Schematics

AG10K Pinout


AG10KSDE176 device is AG10K FPGA bonded with 64MBit 32-bit 166MHz SDRAM. AG10KSDE176 is pin-to-pin compatible with AG16KSDE176.


Download Datasheet

EVB Schematics

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